Sonim Partners with FIH Mobile for Next Generation Rugged Feature Phones
March 5, 2021 | PRNewswireEstimated reading time: Less than a minute
Sonim Technologies, Inc., has announced the selection of FIH Mobile, a subsidiary of Foxconn Technology Group, to support the engineering and manufacturing of Sonim's next generation feature phones. These future devices are expected to leverage QUALCOMM chipsets and feature the unique characteristics that have built Sonim's reputation for the most rugged mobile phones available.
"We selected FIH for this important partnership due to its globally recognized comprehensive cell phone design, development and production capabilities, which will enable us to accelerate the deployment of our highest volume devices in a cost-efficient way," said Tom Wilkinson, Chief Executive Officer. "Additionally, by selecting FIH, Sonim's next generation of feature phone devices will be made at facilities in Vietnam and leverage FIH's unique experience in rugged device manufacturing and working with all US Carriers."
Sonim expects to benefit from FIH's integrated ODM services, including hardware, software, certification and manufacturing. Additionally, working with FIH will provide Sonim access to a best-in-class supply chain and manufacturing process. The first devices are expected to come to market in the third quarter of 2021.
Suggested Items
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
SIA Commends CHIPS Act Incentives for Micron’s Manufacturing Projects in New York and Idaho
04/29/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Micron.
Real Time with… IPC APEX EXPO 2024: Tools, Training, and Trends in Manufacturing Engineering
04/25/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and Product Specialist Erik Bateham of Polar Instruments discuss Polar's latest technology, including their role in aiding manufacturing engineers. They highlight the advanced capabilities of Polar's tools and the critical role of signal integrity analysis, as well as the importance of accurate modeling in board manufacturing. Polar's unique training approach and demonstration contact details are also explored.
TTM Celebrates the Grand Opening of Its First Manufacturing Facility in Penang
04/25/2024 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), officially opened its first manufacturing plant in Penang, Malaysia with an investment of USD200 million (approximately RM958 million).
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.