-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdditive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
The Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Universal Partners with NextFlex to Deliver Advanced Packaging Technology to Binghamton University
April 14, 2022 | Universal InstrumentsEstimated reading time: 2 minutes
Universal Instruments held a ribbon-cutting ceremony for Binghamton University’s acceptance of the company’s High-Speed Wafer Feeder (HSWF) on April 5 at Universal’s corporate headquarters in Conklin, NY. The ceremony included representatives from Universal, Binghamton University and NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute.
For several years, Universal has engaged in a technology roadmap partnership with NextFlex – a consortium of American electronics companies, academic institutions, non-profits, and government partners with the shared goal of advancing U.S. manufacturing of Flexible Hybrid Electronics (FHE). NextFlex has been an important contributor in the development of Universal’s HSWF, helping bring this innovative new product to market. The project was also supported with matching funds from New York State Empire State Development via the Upstate Revitalization Initiative.
Scott Miller, NextFlex Director of Technology, noted, “We’re very happy to be working with Universal on the High-Speed Wafer Feeder and couldn’t be more pleased with the results. The FuzionSC™ Platform and HSWF solution in our advanced lab empowers us to take on the most challenging FHE applications with capabilities that break traditional barriers.”
Under the direction of NextFlex, the HSWF will be installed on the FuzionSC in Binghamton University's Smart Electronics Manufacturing Laboratory (SEMLab) at Binghamton University. The university has owned the FuzionSC for more than three years and worked closely with Universal in leveraging its capabilities to enrich the student experience and collaboration with industry partners.
“The addition of the High-Speed Wafer feeder enables us to give our students unique hands-on experience with the assembly of sophisticated multi-die Heterogeneous Integration (HI) packages, which are created by integrating separately manufactured components into a higher-level assembly. It also allows us to handle very thin die, which is another major challenge facing manufacturers today,” said Dr. Mark Poliks, Director of the Center for Advanced Microelectronics Manufacturing (CAMM), Binghamton University. “It’s been a valuable asset to partner with a leading technology company in our own backyard and we look forward to continued cooperation and knowledge sharing.”
Universal Instruments Vice President of Marketing, Glenn Farris stated, “We achieved our objective in creating an all-in-one solution for HI and our technology collaborations were key in realizing our vision. We’re pleased to introduce it to our local University and help build the future of electronics assembly.” Farris added, “This solution will also support the manufacturers that will benefit from the upcoming CHIPs Act, which came about due to a severe shortage of semiconductor chips and includes $52 billion for domestic semiconductor production.”
Suggested Items
Kimball Electronics Romania Volunteers Deliver Hope and Aid to Remote Mountain Communities
05/20/2024 | Kimball Electronics Inc.A significant portion of the Kimball Electronics Romania leadership team, along with employees and their children, participated in a two-day service project in remote mountain villages within a nearby county.
Danutek Celebrates 20 Anniversary
05/20/2024 | DanutekDanutek, a leading supplier of capital equipment and service support to the electronics manufacturing sector in Europe, proudly marks its 20th anniversary this year.
SPEA Expands in Southeast Asia with New Subsidiary in Thailand
05/17/2024 | SPEASPEA, a global leader in automatic test equipment for the manufacturing of semiconductor, microelectronic and electronic devices, today announced the opening of its new subsidiary in Thailand. This expansion marks a significant step forward in SPEA's commitment to serving the growing Southeast Asian microchip and electronics market with leading-edge manufacturing machinery and equipment.
Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
05/17/2024 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.