New iNEMI Project on High Density Interconnect Socket Warpage Prediction
December 30, 2022 | iNEMIEstimated reading time: 1 minute
iNEMI announces call-for-participation webinar on high density interconnect socket warpage prediction and characterization, phase 2 on January 5-6, 2023.
High-density interconnect sockets are becoming larger, which creates challenges for socket warpage simulation and can impact SMT assembly yield and reliability. Expedited computation that maintains the required level of accuracy is needed to shorten socket design cycles.
Phase 1 of iNEMI’s High-Density Interconnect Socket Warpage Prediction and Characterization project established an analysis and validation framework for socket development, conducted simulation experiments, and initially investigated the impact of socket design, fiber filled material properties and molding process conditions on socket warpage.
Phase 2 will focus on improving socket warpage simulation accuracy and speed, further investigating the impact of molding and design on socket warpage, and will ultimately establish guidelines for dynamic socket warpage measurement and prediction. If you are involved in socket design and development, board assembly and/or reliability, this project will be of interest to you. Please join us to learn more on January 5 or 6. The deadline to sign up for the project is February 17, 2023.
Registration
This webinar is open to industry; advance registration is required For additional information, visit iNEMI's website.
Session 1
Thursday, January 5, 2023
7:00-8:00 a.m. EST (U.S.)
1:00-2:00 p.m. CET (Europe)
8:00-9:00 p.m. CST (China)
Session 2
Friday, January 6
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (U.S.) on January 5
Suggested Items
TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
05/15/2024 | TactoTekPolestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.
The Shaughnessy Report: Unlock Your High-speed Material Constraints
05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportThe world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.
Standard of Excellence: Collaboration—The Right Path to Innovation
05/15/2024 | Anaya Vardya -- Column: Standard of ExcellenceNow more than ever, as new and innovative technologies for printed circuit boards are in demand, we need collaboration between PCB designers, fabricators, and assemblers. Close partnerships with PCB designers and assemblers are key to developing and producing PCBs with boards with new and innovative technology. These collaborative partnerships, along with the partnership with the end customers, are more critical than ever before.
A Potpourri of Design PD Classes
05/14/2024 |What is invention without innovation? What is innovation without capability? Kelly Dack addresses these questions and more in this review of the Professional Development courses at IPC APEX EXPO, including the flex course lead by "Flexperts" Mark Finstad and Nick Koop.
Real Time with… IPC APEX EXPO 2024: Precision Tools and Problem-solving With Perfect Point
05/14/2024 | Real Time with...IPC APEX EXPOIn an interview with Guest Editor Dan Beaulieu, Alex Girardot, a field applications engineer with Perfect Point, shares his experiences with precision tooling. Alex also discusses a challenging project involving thick boards and small diameter holes in which Carbonite tools with a hybrid design were used. They also discuss the trend toward smaller hole sizes.