-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
May 16, 2024 | FoxconnEstimated reading time: 2 minutes
Siemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
The collaboration focuses on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV). Siemens and Foxconn are working together to establish a scalable and seamless engineering and manufacturing ecosystem.
Roland Busch, President and CEO of Siemens AG, emphasized the significance of this partnership: “At Siemens, we believe in the power of partnerships to drive positive change. Our collaboration with Foxconn underscores our commitment to innovation and sustainability as we work together to shape the future of electronics manufacturing.”
Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn), said: “Foxconn is transforming into a platform solutions provider for smart manufacturing, smart EVs and smart cities. Joining forces with Siemens accelerates our digital transformation journey and opens up new possibilities for innovation and sustainability.”
This MoU identifies key collaboration areas to increase the automation level at Foxconn’s facilities. These areas include electronics manufacturing service (EMS) and contract design and manufacturing service (CDMS), which is Foxconn’s innovative business model for electric vehicles. Both companies will explore initiatives to work toward the factory of the future by implementing Siemens’ leading factory automation portfolio and industrial software, which include building blocks such as digital twin technology and artificial intelligence (AI). Siemens Xcelerator, with its comprehensive suite of software and solutions, will play a pivotal role in optimizing Foxconn’s engineering and manufacturing workflows, facilitating efficiency and agility across its operations.
This collaboration aims to leverage how Siemens’ technical expertise can enhance Foxconn’s sustainability performance, contributing to energy savings and a reduced CO2 footprint. This partnership involves establishing transparent monitoring processes and applying professional services and digital solutions because both companies are working toward a greener future for electronics manufacturing.
“Electronics are the backbone of modern society, powering everything from communication to transportation. We are, therefore, very proud to intensify our collaboration with Foxconn,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. “With Siemens’ domain knowhow and leading portfolio in factory automation and software, we’ll accelerate the transformation of the electronics manufacturing industry and support Foxconn to not only achieve its sustainability targets, but also improve efficiency.”
Dr. Zhe Shi, Foxconn’s Chief Digital Officer and head of its Smart Manufacturing platform, added: “Siemens is a leader in providing digital transformation solutions. Our deepening collaboration to build the factory of the future in the AI era will enable us to provide topflight manufacturing service to all our customers.”
Suggested Items
Siemens Simplifies Development of AI Accelerators for Advanced System-on-chip Designs with Catapult AI NN
05/24/2024 | SiemensSiemens Digital Industries Software announced Catapult™ AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs). Catapult AI NN is a complete solution that starts with a neural network description from an AI framework, converts it into C++ and synthesizes it into an RTL accelerator in Verilog or VHDL for implementation in silicon.
Siemens Partners with Microsoft to Deliver AI-enhanced Solutions for Resilient Product Lifecycle Management with Azure
05/14/2024 | PRNewswireSiemens Digital Industries Software announced an expansion of its partnership with Microsoft to make the Siemens Xcelerator as a Service portfolio of industry software available through Microsoft's cloud and AI platform Azure and integrating it with generative AI and Copilot features.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Siemens Nederland, VDL Strengthen Partnership for Second-Generation Automated Guided Vehicles (AGVS)
04/24/2024 | VDL Automated VehiclesThis fall, Siemens Nederland and VDL Automated Vehicles will launch the second generation of their automated logistics platform based on Automated Guided Vehicles (AGVs) for industrial firms with mixed-traffic sites.