Trackwise's 'Improved Harness Technology' Designed into Circuits for Electric Vehicles
April 30, 2020 | Trackwise Designs PLCEstimated reading time: 1 minute
Trackwise Designs has secured a production order for its flexible printed circuit technology, Improved Harness Technology™ (IHT), for delivery in mid 2020. This initial order, in support of initial vehicle production activities, follows successful funded development activities last year for this UK-based designer and manufacturer of electric vehicles.
Trackwise’s IHT is a proprietary roll-to-roll manufacturing process enabling the production of unlimited length, multilayer flexible printed circuits (FPCs). Trackwise’s roll-to-roll technology is being used to manufacture FPCs for use at a module level in both HV and LV circuits in the vehicles' battery packs, reducing the part count, assembly time, and saving on space and weight.
Electric vehicle battery modules are typically cuboid structures of packaged cells which have precisely defined cell connection or monitoring locations that are ideally suited to flex PCBs.
In addition, when battery modules are packaged together to form a complete vehicle battery pack, the battery modules can be connected together by long-length flex PCBs, sometime several metres in length.
Philip Johnston, CEO of Trackwise, commented: "The electric vehicle industry—and specifically EV battery packs—is one of a number of growth markets for Trackwise, and we are delighted to have been selected by an innovator in the field. Following successful development work last year and, more recently, the acquisition of Stevenage Circuits Ltd (SCL) at the beginning of April, this is the next step towards series production of IHT at scale."
Suggested Items
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.