-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Estimated reading time: Less than a minute
EMS Discovers Mature IC Technologies
- Wire bonding;
- Ribbon bonding;
- Die bonding;
- Extraordinarily fine-pitch 0.25-mm pitch BGAs;
- Buried resistance/buried capacitance; and
- Chip on board or CoB.
Editor's Note: This column originally appeared in the December 2013 issue of SMT Magazine.
More Columns from Zulki's PCB Nuggets
Zulki's PCB Nuggets: Cleanliness is Next to ReliabilityZulki’s PCB Nuggets: Thermal Compression Bonding for Extra Fine Pitch Flip Chips
Zulki’s PCB Nuggets: WBAN Steps Into PCB Microelectronics Assembly
Zulki’s PCB Nuggets: Photonics Comes to PCB Microelectronics Assembly
Zulki’s PCB Nuggets: Sub-Micron Die Bonding—Don’t Be Misled by Five Micron Placement Standard
Zulki’s PCB Nuggets: Meet the New Player in PCB Microelectronics Assembly—Interposers
Zulki’s PCB Nuggets: How Effective Is Your PCB Microelectronics Assembly?
Zulki’s PCB Nuggets: Five Key Benefits for Onshoring PCB Microelectronics Assembly