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SEMI, UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States
February 6, 2024 | SEMIEstimated reading time: 1 minute
SEMI announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. Offered by SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) and funded by the National Institute of Standards and Technology (NIST), the Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP) highlights critical areas of development needed to establish advanced packaging facilities on U.S. soil.
Based on the Heterogeneous Integration Roadmap (HIR), the guide incorporates a manufacturing approach to implement the HIR. Some 100 chip industry veterans from more than 40 companies collaborated with representatives from academic institutions, industrial consortia, and government agencies to develop the guide.
Addressing hardware and software tools, manufacturing processes, and supplier infrastructure, the guide covers tools, processes, standards, and interdependencies that enable advanced packaging for high-performance computing (HPC), medical, health and wearables applications.
“The MRHIEP drills down into operational objectives by examining current capabilities and highlighting critical areas of development needed for onshored manufacturing to be successful in the U.S.,” said Melissa Grupen-Shemansky, SEMI CTO. “The guide provides vital support for implementation of the HIR, a comprehensive document addressing the global supply chain for heterogenous integration.”
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Podcast Review: On the Line with… Designing for Reality
05/09/2024 | Duane Benson, Positive Edge LLCAs a technologist, if I were forced to come up with just one recurring theme that I might call a professional “nemesis,” it would be the difference between theory and reality. A lot of technology we have at our disposal works well in theory but falls short when reality hits. That’s not the only reason I chose to listen to and review On the Line with… Designing for Reality, featuring a series of conversations with ASC Sunstone’s Matt Stevenson, but it certainly helped that the title caught my eye.
NEOTech Positions Itself as Microelectronics Industry Leader with High-Technology Investments
05/09/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, announces a significant investment in acquiring new Palomar 8100 wire bonder machines, enhancing the company’s positioning as a leader of cutting-edge microelectronics assemblies for mission-critical applications.
MKS’ Atotech, ESI to Participate in CPCA Show
05/09/2024 | MKS’ AtotechMKS’ Atotech, and ESI will participate in the CPCA Show 2024. The show will be held from May 13 to 15, 2024, at the National Exhibition and Convention Center (Shanghai) and will bring together domestic and international manufacturers in the electronic circuit industry.
Dragonfly Energy Announces Breakthrough in Lithium Battery Production: Eliminating Harmful 'Forever Chemicals'
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.