Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.
Written by Anaya Vardya, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.
PCB designers and design engineers, both new and veteran, will learn how to “beat the heat” by gaining a thorough understanding of thermal management design processes.
ISBN: 978-1-7342005-5-3
Anaya Vardya has over 35 years in the electronics manufacturing business and is currently the president and CEO of American Standard Circuits Inc. Anaya was previously COO of Canadian-based Coretec Inc. and senior VP of operations at Merix (both now part of TTM). He was also the corporate development manager at Continental Circuits, and before that, he had a variety of management and non-management positions in IBM Endicott and IBM Austin. Anaya holds a master’s degree in chemical engineering from the University of Cincinnati and a bachelor of technology from the Indian Institute of Technology.
American Standard Circuits (ASC) and Sunstone Circuits have joined forces to create a formidable entity in PCB manufacturing, leveraging over 50 years of combined industry expertise. This unified collaboration harnesses ASC's comprehensive solutions expertise and Sunstone's focus on rapid turnaround, top-quality PCBs, and unparalleled customer support.
Our commitment extends to providing a diverse range of PCB types customized for various industries, including military/aerospace, industrial, commercial, medical, telecommunications, consumer electronics, RF/microwave, and transportation sectors. ASC-Sunstone stands as a hub for excellence in PCB manufacturing, simplifying procurement while delivering top-notch products.
At the forefront of technology, our ongoing research and development in thermal management and embedded passive components enable us to meet the demands of ever-evolving computing devices. Our specialties encompass hybrid circuits, exotic materials, blind and buried vias, controlled impedance, and patented thermal management solutions.
Quality is our hallmark. ASC holds certifications such as AS9100 Rev. C, ISO 9001:2008, and MIL PRF 31032, reinforced by state-of-the-art process control systems. Rigorous SPC controls, automated optical inspection, metallographic cross-section, and electrical test facilities ensure we meet and exceed the high standards set by our customers.
We understand the urgency of timelines in the industry. ASC-Sunstone prides itself on quick-turn capabilities across all our manufacturing technologies. Our cutting-edge front-end engineering CAM systems and rapid-response manufacturing processes enable us to provide swift solutions for our customers.
For more information on our wide range of offerings and quick-turn options, visit www.ascsunstone.com. Together, ASC and Sunstone set a new standard of excellence in PCB manufacturing, offering unmatched expertise, support, and top-quality products across diverse industry sectors.
Dr. Johannes Adam Consultant,
ADAM Research
Dr. Johannes Adam received his doctorate in physics from the University of Heidelberg, Germany, in 1989 with a thesis on the numerical treatment of three-dimensional radiative transfer. He then worked in various software companies, mainly on numerical simulations of electronics cooling and in [...]
Denis Boulanger Principal Manufacturing Engineer,
Raytheon Technologies
Denis Boulanger has over 35 years’ experience in the electronics manufacturing business and is currently a principal manufacturing engineer at Raytheon Technologies. Boulanger was previously a senior manufacturing engineer at Technovative Applications. He spent 25 years in the PCB laminate [...]
Chapter Summaries
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Chapter 1
Thermal Vias
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Chapter 2
IMPCBs or MCPCBs
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Chapter 3
Metal-Core Boards
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Chapter 4
RF Thermal Management Fabrication Methods
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Chapter 5
Mixed Technology