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Real Time with… IPC APEX EXPO 2024: Advanced Technologies with BlueRing Stencils

05/28/2024 | Real Time with...IPC APEX EXPO
Guest Editor Kelly Dack and Greg Smith, manager of stencil technology with BlueRing Stencils, discuss the company's capabilities and services. They explore the use of nano coatings for thin stencils and determining the area ratio. Greg emphasizes the role of stencil artwork in controlling solder deposition and the need for collaboration between designers and stencil companies. They also focus on thinner stencils and step stenciling techniques for achieving proper solder deposition.

Vision Engineering Celebrates 30 Years of Mantis

05/27/2024 | Vision Engineering
Vision Engineering, the world-leading provider of innovative inspection, metrology, and digital 3D visualization solutions, is celebrating the 30th anniversary of its best-selling and award-winning Mantis range of ergonomic optical stereo microscopes.

DARPA Shows Concepts for the Future of VTOL Uncrewed Aerial Systems

05/27/2024 | DARPA
DARPA’s AdvaNced airCraft Infrastructure-Less Launch And RecoverY program, known as ANCILLARY, shows six design concepts for a low-weight, large-payload, long-endurance VTOL uncrewed X-plane.

Wearable Devices Get Signal Boost from Innovative Material

05/25/2024 | Rice University
A new material that moves like skin while preserving signal strength in electronics could enable the development of next-generation wearable devices with continuous, consistent wireless and battery-free functionality.

The Big Picture: Quality Front-end Engineering as a Core Differentiator

05/28/2024 | Mehul Davé -- Column: The Big Picture
In the PCB industry, high-quality front-end engineering differentiates the top-notch companies from those struggling to keep their customers satisfied. But what determines good quality? Beginning with careful attention to design specifications, front-end engineers meticulously plan layouts while adhering to industry standards such as IPC guidelines. They employ advanced design software to optimize PCB layouts, focusing on signal integrity, thermal management, and manufacturability.
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